Teledyne FLIR Boson Development Board

Color Palette Comparison

Fieldometer

Field of View Ratio Rule

Export Conditions

Thermal Simulator

Teledyne FLIR Boson Development Board

Highlights:

Full access to Boson 80-pin interface allows connection to:

USB 3
100/GigE Ethernet
CameraLink
Serial Com
Micro SDCard
I2C
SPI
SDIO
VSYNC/RESET
GPIO

SKU: 250-0705-00

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$1,400.00

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Boson Test Board, Detail PCB ASSEMBLY

Name: Teledyne FLIR Boson Development Board
Brand: Teledyne FLIR
SKU: 250-0705-00
Price: 1400.00 USD
Availability: InStock

Boson Development Board

The Development breakout board for Boson users and integrators that need easy access to the Boson I/O and interfaces. This board is intended for user development purposes, and is not intended or rated for long term reliability over temperature.

It provides full access to the Boson 80-pin connector with a number of connectors:

standard USB-3 micro-B (Super Speed) receptacle
standard SDR-26 receptacle with Camera-Link compliant output
SDIO card slot
UART header
I2C header
SPI header
Power jacks

OVERVIEW

Radiometric

INFORMATION

Specifications

	RC-IF	VPC TTL	LOW PROFILE VPC	USB VPC KIT	USB/Analog VPC Kit	Boson Development Board	USB/CameraLink Board

Power
Voltage Input	6-26Volts DC	5-26Volts DC	5-26Volts DC	5Volts DC	5Volts DC	5-12Volts DC	5Volts DC
Voltage Output	Regulated 5Volts DC					1.8-3.3Volts DC
Power via USB
Power via 6-Pin JST
Power via 7-Pin PicoBlade
Image Control
FFC Control
DDE Control
AGC Control
Digital Zoom
Continuous Digital Zoom
Flip / Mirror Image	VIA GUI
Video via USB
Palette Select via FLIR GUI
Assignable PWM Inputs
Assignable S-Bus Inputs
Video Output
Digital Video Output
Composite Video Outputs Available	2	2	2		1	USB Only	SDR-26
CameraLink
Video Sync
Via 6-pin JST
Via PicoBlade
Interface Options
80-pin Connection
USB 3 Connection
JST Connection
Serial Communication
SDR-26
100/GigE Ethernet^*						^*
Storage Options
Micro SDCard^*						^*